Multi-Billion-Dollar Deal to Accelerate Chip Development in Ohio
Intel Corporation and Amazon Web Services (AWS) have announced a significant expansion of their longstanding partnership, with a new multi-year, multi-billion-dollar agreement to co-develop custom chips. This collaboration will focus on accelerating chip manufacturing in Ohio, where Intel has been steadily building its advanced semiconductor manufacturing capabilities.
The deal will see Intel producing custom AI chips for AWS, helping to support a wide range of workloads, including artificial intelligence (AI) applications. Intel’s production will focus on cutting-edge technologies, with custom chips being manufactured on Intel’s 18A and 3 process nodes.
Strengthening Ohio’s Role as a Hub for AI and Semiconductor Innovation
As part of the collaboration, AWS will invest $7.8 billion to expand its data center operations in Central Ohio, in addition to the $10.3 billion it has invested in the region since 2015. Ohio Governor Mike DeWine applauded the partnership, saying it strengthens Ohio’s leadership in AI and U.S.-based semiconductor manufacturing. This expansion not only reinforces Intel’s commitment to domestic production but also aligns with AWS’s continued investment in the state’s growing technology ecosystem.
Looking Forward: Innovation and AI Ecosystem Growth
Intel will produce advanced AI fabric chips for AWS, utilizing its most sophisticated production technologies. Intel CEO Pat Gelsinger highlighted that this partnership will drive innovation within both companies’ ecosystems while supporting the growth of a sustainable U.S.-based AI supply chain. AWS CEO Matt Garman echoed the sentiment, emphasizing the long-standing collaboration, which has empowered joint customers since the launch of the first Amazon EC2 instance in 2006.
Both companies are poised to explore further custom chip designs, with plans for future production at Intel’s Ohio facilities, ensuring a strong future for AI and semiconductor advancements in the region.